The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device

• Main Authors: Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2023
• Subjects: Engineering::Electrical and electronic engineering::Electronic packaging; Grounding Plane; Heterogenous Integration
• Online Access: https://hdl.handle.net/10356/166181
• Institution: Nanyang Technological University

In this work, we demonstrate the addition of grounding plane into the through silicon via (TSV) integrated ion trap to minimize the ion trap heating by effectively shielding the lossy silicon substrate from RF penetration. Windows are made onto this grounding plane to allow the passing through of th...