Measurement of residual stress developed during advanced semiconductor packaging process

• Main Author: Huang, Guanbo.
• Other Authors: Zhong Zhaowei
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/17302
• Institution: Nanyang Technological University

This research report provides a focused investigation and theoretical review of thermal mismatch induced residual stress in semiconductor assembly and the application of utilizing piezoresistive stress sensor to conduct nondestructive measurement of such stress. In semiconductor fabrication process...