Measurement of residual stress developed during advanced semiconductor packaging process
This research report provides a focused investigation and theoretical review of thermal mismatch induced residual stress in semiconductor assembly and the application of utilizing piezoresistive stress sensor to conduct nondestructive measurement of such stress. In semiconductor fabrication process...
Saved in:
Main Author: | Huang, Guanbo. |
---|---|
Other Authors: | Zhong Zhaowei |
Format: | Final Year Project |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/17302 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Study and development of advanced packaging technique for semiconductor lasers
by: Teo, Ronnie Jin Wah
Published: (2010) -
A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing
by: Ng, Shioo Wat.
Published: (2008) -
Design and application of precision automation for various semiconductor electronic packaging technologies
by: Chew, Keng Hock.
Published: (2008) -
Thermal stress and fatigue analysis of microelectronic packaging
by: Tan, Meng Leong.
Published: (2011) -
Thermal stress analysis of electronic packaging components
by: See Toh, Chee Wai.
Published: (2008)