Electroplating of copper for application in sub-0.25 micron device manufacturing
An in-depth study of the copper electroplating process was carried out with different process parameters such as seed materials, current densities and electrolytes in order to fabricate nanocrystalline electroplated copper to fill up the line and via trenches in sub-0.25 urn devices. The effect of a...
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2009
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| Online Access: | http://hdl.handle.net/10356/19328 |
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sg-ntu-dr.10356-193282020-09-27T20:13:58Z Electroplating of copper for application in sub-0.25 micron device manufacturing Seah, Chin Hwee. School of Applied Science S.Mridha DRNTU::Science An in-depth study of the copper electroplating process was carried out with different process parameters such as seed materials, current densities and electrolytes in order to fabricate nanocrystalline electroplated copper to fill up the line and via trenches in sub-0.25 urn devices. The effect of annealing on the morphology and properties of the electroplated copper was also investigated. Master of Applied Science 2009-12-08T03:34:01Z 2009-12-08T03:34:01Z 2000 2000 Thesis http://hdl.handle.net/10356/19328 en 169 p. application/pdf |
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Nanyang Technological University |
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Singapore |
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English |
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DRNTU::Science |
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DRNTU::Science Seah, Chin Hwee. Electroplating of copper for application in sub-0.25 micron device manufacturing |
| description |
An in-depth study of the copper electroplating process was carried out with different process parameters such as seed materials, current densities and electrolytes in order to fabricate nanocrystalline electroplated copper to fill up the line and via trenches in sub-0.25 urn devices. The effect of annealing on the morphology and properties of the electroplated copper was also investigated. |
| author2 |
School of Applied Science |
| author_facet |
School of Applied Science Seah, Chin Hwee. |
| format |
Theses and Dissertations |
| author |
Seah, Chin Hwee. |
| author_sort |
Seah, Chin Hwee. |
| title |
Electroplating of copper for application in sub-0.25 micron device manufacturing |
| title_short |
Electroplating of copper for application in sub-0.25 micron device manufacturing |
| title_full |
Electroplating of copper for application in sub-0.25 micron device manufacturing |
| title_fullStr |
Electroplating of copper for application in sub-0.25 micron device manufacturing |
| title_full_unstemmed |
Electroplating of copper for application in sub-0.25 micron device manufacturing |
| title_sort |
electroplating of copper for application in sub-0.25 micron device manufacturing |
| publishDate |
2009 |
| url |
http://hdl.handle.net/10356/19328 |
| _version_ |
1681056277768175616 |