Electroplating of copper for application in sub-0.25 micron device manufacturing
An in-depth study of the copper electroplating process was carried out with different process parameters such as seed materials, current densities and electrolytes in order to fabricate nanocrystalline electroplated copper to fill up the line and via trenches in sub-0.25 urn devices. The effect of a...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2009
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/19328 |
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