Electromigration reliability of copper interconnect in submicron microelectronics application

In this dissertation, the effects of temperature and interconnect properties on copper metallization electromigration are discussed. Accelerated Life Testing is used to obtain performance data on devices at a quicker rate.

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Bibliographic Details
Main Author:	Ang, Kian Ann
Other Authors:	Prasad, Krishnamachar
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:	http://hdl.handle.net/10356/3326
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3326
record_format	dspace
spelling	sg-ntu-dr.10356-33262023-07-04T15:17:52Z Electromigration reliability of copper interconnect in submicron microelectronics application Ang, Kian Ann Prasad, Krishnamachar School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics In this dissertation, the effects of temperature and interconnect properties on copper metallization electromigration are discussed. Accelerated Life Testing is used to obtain performance data on devices at a quicker rate. Master of Science (Microelectronics) 2008-09-17T09:27:27Z 2008-09-17T09:27:27Z 2005 2005 Thesis http://hdl.handle.net/10356/3326 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Ang, Kian Ann Electromigration reliability of copper interconnect in submicron microelectronics application
description	In this dissertation, the effects of temperature and interconnect properties on copper metallization electromigration are discussed. Accelerated Life Testing is used to obtain performance data on devices at a quicker rate.
author2	Prasad, Krishnamachar
author_facet	Prasad, Krishnamachar Ang, Kian Ann
format	Theses and Dissertations
author	Ang, Kian Ann
author_sort	Ang, Kian Ann
title	Electromigration reliability of copper interconnect in submicron microelectronics application
title_short	Electromigration reliability of copper interconnect in submicron microelectronics application
title_full	Electromigration reliability of copper interconnect in submicron microelectronics application
title_fullStr	Electromigration reliability of copper interconnect in submicron microelectronics application
title_full_unstemmed	Electromigration reliability of copper interconnect in submicron microelectronics application
title_sort	electromigration reliability of copper interconnect in submicron microelectronics application
publishDate	2008
url	http://hdl.handle.net/10356/3326
_version_	1772826380233342976

Electromigration reliability of copper interconnect in submicron microelectronics application

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