Electromigration reliability of copper interconnect in submicron microelectronics application

• Main Author: Ang, Kian Ann
• Other Authors: Prasad, Krishnamachar
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/3326
• Institution: Nanyang Technological University

In this dissertation, the effects of temperature and interconnect properties on copper metallization electromigration are discussed. Accelerated Life Testing is used to obtain performance data on devices at a quicker rate.