Device "S" leakage failure due to plasma damage

Study of the plasma damage in sub micrometer CMOS devices and investigate the root cause of leakage failure on specific products in the fab. On top of that, several experimental studies were carried out to study the influence of deposition rate as well as sputter rate on the liner thickness.

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Bibliographic Details
Main Author: Tan, Siew Yoon.
Other Authors: Prasad, Krishnamachar
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3385
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Institution: Nanyang Technological University
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