Characterization and modeling of on-wafer interconnects for RFICs

• 主要作者: Shi, Xiaomeng
• 其他作者: Yeo Kiat Seng
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• 在線閱讀: https://hdl.handle.net/10356/3506

This thesis addresses the characterization and modeling of on-wafer interconnects for CMOS RFICs. A scalable equivalent circuit model for complex-shaped interconnects is proposed. In this proposed structure, frequency-variant characteristics are modeled by frequency independent components. Therefore...