Characterization and modeling of on-wafer interconnects for RFICs

Characterization and modeling of on-wafer interconnects for RFICs

This thesis addresses the characterization and modeling of on-wafer interconnects for CMOS RFICs. A scalable equivalent circuit model for complex-shaped interconnects is proposed. In this proposed structure, frequency-variant characteristics are modeled by frequency independent components. Therefore...

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書目詳細資料
主要作者:	Shi, Xiaomeng
其他作者:	Yeo Kiat Seng
格式:	Theses and Dissertations
出版:	2008
主題:	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
在線閱讀:	https://hdl.handle.net/10356/3506
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Nanyang Technological University

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