Characterization and modeling of on-wafer interconnects for RFICs

• Main Author: Shi, Xiaomeng
• Other Authors: Yeo Kiat Seng
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: https://hdl.handle.net/10356/3506
• Institution: Nanyang Technological University

This thesis addresses the characterization and modeling of on-wafer interconnects for CMOS RFICs. A scalable equivalent circuit model for complex-shaped interconnects is proposed. In this proposed structure, frequency-variant characteristics are modeled by frequency independent components. Therefore...