Investigating the electromigration reliability of copper interconnects

170 p.

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Bibliographic Details
Main Author:	Shao, Wei
Other Authors:	Subodh Gautam Mhaisalkar
Format:	Theses and Dissertations
Published:	2010
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	https://hdl.handle.net/10356/35955
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Institution:	Nanyang Technological University

Description
Summary:	170 p.

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