Investigating the electromigration reliability of copper interconnects

170 p.

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Bibliographic Details
Main Author:	Shao, Wei
Other Authors:	Subodh Gautam Mhaisalkar
Format:	Theses and Dissertations
Published:	2010
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	https://hdl.handle.net/10356/35955
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-35955
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spelling	sg-ntu-dr.10356-359552023-03-04T16:39:48Z Investigating the electromigration reliability of copper interconnects Shao, Wei Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects 170 p. With changing materials systems and interconnect architectures from Al based metallization to Cu dual damascene based metallization, electromigration (EM) continues to be a major reliability concern. The objectives of this research are to investigate EM behavior of Cu interconnects, develop an in-depth understanding of the EM-induced voiding mechanisms, and lastly to suggest methodologies to improve the reliability of dual damascene Cu interconnects. DOCTOR OF PHILOSOPHY (MSE) 2010-04-23T02:14:46Z 2010-04-23T02:14:46Z 2007 2007 Thesis Shao, W. (2007). Investigating the electromigration reliability of copper interconnects. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/35955 10.32657/10356/35955 application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Shao, Wei Investigating the electromigration reliability of copper interconnects
description	170 p.
author2	Subodh Gautam Mhaisalkar
author_facet	Subodh Gautam Mhaisalkar Shao, Wei
format	Theses and Dissertations
author	Shao, Wei
author_sort	Shao, Wei
title	Investigating the electromigration reliability of copper interconnects
title_short	Investigating the electromigration reliability of copper interconnects
title_full	Investigating the electromigration reliability of copper interconnects
title_fullStr	Investigating the electromigration reliability of copper interconnects
title_full_unstemmed	Investigating the electromigration reliability of copper interconnects
title_sort	investigating the electromigration reliability of copper interconnects
publishDate	2010
url	https://hdl.handle.net/10356/35955
_version_	1759857432804196352

Investigating the electromigration reliability of copper interconnects

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