Development of void growth model during electromigration test

Development of void growth model during electromigration test

Electromigration (EM) has been researched extensively for the past 30 years. Despite the huge amount of research conducted, electromigration is not yet fully understood. Furthermore, results produced by some researchers are contradictory, which adds confusion onto the deficiency. The cause is mainly...

Full description

Saved in:
Bibliographic Details
Main Author: Yeo, Mei Chun.
Other Authors: Tan, Cher Ming
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:http://hdl.handle.net/10356/3886
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
id sg-ntu-dr.10356-3886
record_format dspace
spelling sg-ntu-dr.10356-38862023-07-04T15:44:54Z Development of void growth model during electromigration test Yeo, Mei Chun. Tan, Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Electromigration (EM) has been researched extensively for the past 30 years. Despite the huge amount of research conducted, electromigration is not yet fully understood. Furthermore, results produced by some researchers are contradictory, which adds confusion onto the deficiency. The cause is mainly the lack of understanding on the diffusion and failure mechanisms during EM. Master of Engineering 2008-09-17T09:39:42Z 2008-09-17T09:39:42Z 2002 2002 Thesis http://hdl.handle.net/10356/3886 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Yeo, Mei Chun.
Development of void growth model during electromigration test
description Electromigration (EM) has been researched extensively for the past 30 years. Despite the huge amount of research conducted, electromigration is not yet fully understood. Furthermore, results produced by some researchers are contradictory, which adds confusion onto the deficiency. The cause is mainly the lack of understanding on the diffusion and failure mechanisms during EM.
author2 Tan, Cher Ming
author_facet Tan, Cher Ming
Yeo, Mei Chun.
format Theses and Dissertations
author Yeo, Mei Chun.
author_sort Yeo, Mei Chun.
title Development of void growth model during electromigration test
title_short Development of void growth model during electromigration test
title_full Development of void growth model during electromigration test
title_fullStr Development of void growth model during electromigration test
title_full_unstemmed Development of void growth model during electromigration test
title_sort development of void growth model during electromigration test
publishDate 2008
url http://hdl.handle.net/10356/3886
_version_ 1772826282185195520

Similar Items