Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects

This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.

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Bibliographic Details
Main Author: Liu, Bo
Other Authors: Wong Kin Shun Terrence
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/4112
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Institution: Nanyang Technological University
Description
Summary:This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.