Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects

• Main Author: Liu, Bo
• Other Authors: Wong Kin Shun Terrence
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
• Online Access: https://hdl.handle.net/10356/4112
• Institution: Nanyang Technological University

This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.