Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects

This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.

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Bibliographic Details
Main Author:	Liu, Bo
Other Authors:	Wong Kin Shun Terrence
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
Online Access:	https://hdl.handle.net/10356/4112
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Institution:	Nanyang Technological University

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spelling	sg-ntu-dr.10356-41122023-07-04T17:37:42Z Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects Liu, Bo Wong Kin Shun Terrence School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied. MASTER OF ENGINEERING (EEE) 2008-09-17T09:44:43Z 2008-09-17T09:44:43Z 2008 2008 Thesis Liu, B. (2008). Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/4112 10.32657/10356/4112 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials Liu, Bo Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
description	This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.
author2	Wong Kin Shun Terrence
author_facet	Wong Kin Shun Terrence Liu, Bo
format	Theses and Dissertations
author	Liu, Bo
author_sort	Liu, Bo
title	Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
title_short	Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
title_full	Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
title_fullStr	Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
title_full_unstemmed	Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
title_sort	carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
publishDate	2008
url	https://hdl.handle.net/10356/4112
_version_	1772828180720123904

Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects

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