Physical and electrical failure analysis of Cu/low k interconnect system

• 主要作者: Lau, Fu Long.
• 其他作者: Gan Chee Lip
• 格式: Final Year Project
• 語言: English
• 出版: 2011
• 主題: DRNTU::Engineering
• 在線閱讀: http://hdl.handle.net/10356/44535
• 機構: Nanyang Technological University

Time-dependent dielectric breakdown (TDDB) is becoming one of the main reliability issues of Cu/low-k interconnect. In the study of TDDB breakdown mechanisms, a non-conventional single terminated tip test structure that provides easier failure site identification has been used. A new single terminat...