Physical and electrical failure analysis of Cu/low k interconnect system

• Main Author: Lau, Fu Long.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/44535
• Institution: Nanyang Technological University

Time-dependent dielectric breakdown (TDDB) is becoming one of the main reliability issues of Cu/low-k interconnect. In the study of TDDB breakdown mechanisms, a non-conventional single terminated tip test structure that provides easier failure site identification has been used. A new single terminat...