Impact of spike anneal on ultra shallow junction formation
This report explains the need for ultra shallow junctions for modern day CMOS devices, how spike anneal can help achieve this, reviews the important parameters if this process and how these parameters affect the performances of the CMOS transistors.
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2008
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Online Access: | http://hdl.handle.net/10356/4545 |
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sg-ntu-dr.10356-45452023-07-04T15:08:41Z Impact of spike anneal on ultra shallow junction formation Lai, Chung Woh School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics This report explains the need for ultra shallow junctions for modern day CMOS devices, how spike anneal can help achieve this, reviews the important parameters if this process and how these parameters affect the performances of the CMOS transistors. Master of Science (Microelectronics) 2008-09-17T09:53:54Z 2008-09-17T09:53:54Z 2002 2002 Thesis http://hdl.handle.net/10356/4545 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Lai, Chung Woh Impact of spike anneal on ultra shallow junction formation |
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This report explains the need for ultra shallow junctions for modern day CMOS devices, how spike anneal can help achieve this, reviews the important parameters if this process and how these parameters affect the performances of the CMOS transistors. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Lai, Chung Woh |
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Theses and Dissertations |
author |
Lai, Chung Woh |
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Lai, Chung Woh |
title |
Impact of spike anneal on ultra shallow junction formation |
title_short |
Impact of spike anneal on ultra shallow junction formation |
title_full |
Impact of spike anneal on ultra shallow junction formation |
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Impact of spike anneal on ultra shallow junction formation |
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Impact of spike anneal on ultra shallow junction formation |
title_sort |
impact of spike anneal on ultra shallow junction formation |
publishDate |
2008 |
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http://hdl.handle.net/10356/4545 |
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1772829148514877440 |