Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate

• المؤلف الرئيسي: Hu, YingYong
• مؤلفون آخرون: Huang Weimin
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/46439

Stress and thermomechanical behavior of thin films deposited atop a substrate upon thermal loading/unloading have been investigated extensively in the past decades, which was partially stimulated by the development of micro- and nanotechnology. However, most of the previous effort in analysis was fo...