Thermal stress and fatigue analysis of microelectronic packaging
62 p.
محفوظ في:
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| التنسيق: | Theses and Dissertations |
| منشور في: |
2011
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| الوصول للمادة أونلاين: | http://hdl.handle.net/10356/47133 |
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sg-ntu-dr.10356-471332023-03-11T17:29:23Z Thermal stress and fatigue analysis of microelectronic packaging Tan, Meng Leong. Pang Hock Lye, John Wang Yu Po School of Mechanical and Production Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging 62 p. A programme written by Robert Darveaux was downloaded and run using ANSYS™ 5.3 in this project to develop better understanding of mechanical failures in electronic packaging and SMT solder joints caused by mismatch of coefficient of thermal expansions between the materials. Simulation of thermal cycles which modern encapsulated IC chips such as Plastic Ball Grid Array (PBGA) DRAM chips are expected to experience was imposed on to the finite element model and results obtained were studied and analysed. Master of Science (Mechanics & Processing of Materials) 2011-12-27T06:28:00Z 2011-12-27T06:28:00Z 1998 1998 Thesis http://hdl.handle.net/10356/47133 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| spellingShingle |
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Tan, Meng Leong. Thermal stress and fatigue analysis of microelectronic packaging |
| description |
62 p. |
| author2 |
Pang Hock Lye, John |
| author_facet |
Pang Hock Lye, John Tan, Meng Leong. |
| format |
Theses and Dissertations |
| author |
Tan, Meng Leong. |
| author_sort |
Tan, Meng Leong. |
| title |
Thermal stress and fatigue analysis of microelectronic packaging |
| title_short |
Thermal stress and fatigue analysis of microelectronic packaging |
| title_full |
Thermal stress and fatigue analysis of microelectronic packaging |
| title_fullStr |
Thermal stress and fatigue analysis of microelectronic packaging |
| title_full_unstemmed |
Thermal stress and fatigue analysis of microelectronic packaging |
| title_sort |
thermal stress and fatigue analysis of microelectronic packaging |
| publishDate |
2011 |
| url |
http://hdl.handle.net/10356/47133 |
| _version_ |
1761781416780103680 |