Thermal stress and fatigue analysis of microelectronic packaging

62 p.

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Bibliographic Details
Main Author:	Tan, Meng Leong.
Other Authors:	Pang Hock Lye, John
Format:	Theses and Dissertations
Published:	2011
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:	http://hdl.handle.net/10356/47133
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Institution:	Nanyang Technological University

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