Electrochemical plated copper for interconnect applications
Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the ef...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/4796 |
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| Institution: | Nanyang Technological University |
| Summary: | Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the effects of substrate on the properties of the electroplated Cu films. |
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