Electrochemical plated copper for interconnect applications

• Main Author: Loh, Stephen Soon Ann.
• Other Authors: Zhang, Dao Hua
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• Online Access: http://hdl.handle.net/10356/4796
• Institution: Nanyang Technological University

Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the ef...