Electrochemical plated copper for interconnect applications

Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the ef...

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Bibliographic Details
Main Author:	Loh, Stephen Soon Ann.
Other Authors:	Zhang, Dao Hua
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Online Access:	http://hdl.handle.net/10356/4796
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-4796
record_format	dspace
spelling	sg-ntu-dr.10356-47962023-07-04T16:00:18Z Electrochemical plated copper for interconnect applications Loh, Stephen Soon Ann. Zhang, Dao Hua School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the effects of substrate on the properties of the electroplated Cu films. Master of Engineering 2008-09-17T09:58:51Z 2008-09-17T09:58:51Z 2004 2004 Thesis http://hdl.handle.net/10356/4796 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Loh, Stephen Soon Ann. Electrochemical plated copper for interconnect applications
description	Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the effects of substrate on the properties of the electroplated Cu films.
author2	Zhang, Dao Hua
author_facet	Zhang, Dao Hua Loh, Stephen Soon Ann.
format	Theses and Dissertations
author	Loh, Stephen Soon Ann.
author_sort	Loh, Stephen Soon Ann.
title	Electrochemical plated copper for interconnect applications
title_short	Electrochemical plated copper for interconnect applications
title_full	Electrochemical plated copper for interconnect applications
title_fullStr	Electrochemical plated copper for interconnect applications
title_full_unstemmed	Electrochemical plated copper for interconnect applications
title_sort	electrochemical plated copper for interconnect applications
publishDate	2008
url	http://hdl.handle.net/10356/4796
_version_	1772826962212945920

Electrochemical plated copper for interconnect applications

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