Reliability of copper wire bonding
In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding.
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/50233 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding. |
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