Reliability of copper wire bonding
In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project |
| Language: | English |
| Published: |
2012
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/50233 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |
Be the first to leave a comment!