Reliability of copper wire bonding

In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding.

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Bibliographic Details
Main Author: Ang, Joash Wei Qiang
Other Authors: Tang Xiaohong
Format: Final Year Project
Language:English
Published: 2012
Subjects:
Online Access:http://hdl.handle.net/10356/50233
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Institution: Nanyang Technological University
Language: English

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