Reliability of copper wire bonding
In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding.
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| Format: | Final Year Project |
| Language: | English |
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2012
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| Online Access: | http://hdl.handle.net/10356/50233 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-502332023-07-07T17:32:37Z Reliability of copper wire bonding Ang, Joash Wei Qiang Tang Xiaohong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding. Bachelor of Engineering 2012-05-31T03:27:00Z 2012-05-31T03:27:00Z 2012 2012 Final Year Project (FYP) http://hdl.handle.net/10356/50233 en Nanyang Technological University 51 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| language |
English |
| topic |
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics |
| spellingShingle |
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Ang, Joash Wei Qiang Reliability of copper wire bonding |
| description |
In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding. |
| author2 |
Tang Xiaohong |
| author_facet |
Tang Xiaohong Ang, Joash Wei Qiang |
| format |
Final Year Project |
| author |
Ang, Joash Wei Qiang |
| author_sort |
Ang, Joash Wei Qiang |
| title |
Reliability of copper wire bonding |
| title_short |
Reliability of copper wire bonding |
| title_full |
Reliability of copper wire bonding |
| title_fullStr |
Reliability of copper wire bonding |
| title_full_unstemmed |
Reliability of copper wire bonding |
| title_sort |
reliability of copper wire bonding |
| publishDate |
2012 |
| url |
http://hdl.handle.net/10356/50233 |
| _version_ |
1772825680389603328 |