Study of the interfaces between electroless nickel under bump metallization and lead-free solders

Study of the interfaces between electroless nickel under bump metallization and lead-free solders

This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical...

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Main Author: He, Min.
Other Authors: Chen, Zhong
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:http://hdl.handle.net/10356/5052
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-50522020-06-01T11:56:54Z Study of the interfaces between electroless nickel under bump metallization and lead-free solders He, Min. Chen, Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical strength of the solder joints has been studied using a tensile test. Comparison of these solder/UBM systems is made in order to obtain a systematic and comprehensive understanding of the interaction in reflow and thermal aging processes. There are three separate but interrelated sub-topics in the present experimental investigation. Doctor of Philosophy (SME) 2008-09-17T10:18:36Z 2008-09-17T10:18:36Z 2004 2004 Thesis http://hdl.handle.net/10356/5052 Nanyang Technological University 214 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
He, Min.
Study of the interfaces between electroless nickel under bump metallization and lead-free solders
description This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical strength of the solder joints has been studied using a tensile test. Comparison of these solder/UBM systems is made in order to obtain a systematic and comprehensive understanding of the interaction in reflow and thermal aging processes. There are three separate but interrelated sub-topics in the present experimental investigation.
author2 Chen, Zhong
author_facet Chen, Zhong
He, Min.
format Theses and Dissertations
author He, Min.
author_sort He, Min.
title Study of the interfaces between electroless nickel under bump metallization and lead-free solders
title_short Study of the interfaces between electroless nickel under bump metallization and lead-free solders
title_full Study of the interfaces between electroless nickel under bump metallization and lead-free solders
title_fullStr Study of the interfaces between electroless nickel under bump metallization and lead-free solders
title_full_unstemmed Study of the interfaces between electroless nickel under bump metallization and lead-free solders
title_sort study of the interfaces between electroless nickel under bump metallization and lead-free solders
publishDate 2008
url http://hdl.handle.net/10356/5052
_version_ 1681058865890721792

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