Study of the interfaces between electroless nickel under bump metallization and lead-free solders

• Main Author: He, Min.
• Other Authors: Chen, Zhong
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/5052
• Institution: Nanyang Technological University

This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical...