Development of magnetic current imaging for the failure analysis of 3D package technology

• 主要作者: Kor, Katherine Hwee Boon.
• 其他作者: Gan Chee Lip
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2013
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials; DRNTU::Engineering::Materials::Electronic packaging materials
• 在線閱讀: http://hdl.handle.net/10356/51193

“More than Moore” trend has triggered the development of three-dimensional (3D) technologies which are important in terms of their reliability and performance. However, the introduction of these new technologies presents new challenges in fault isolation and failure analysis of short circuits, open...