Development of magnetic current imaging for the failure analysis of 3D package technology

• Main Author: Kor, Katherine Hwee Boon.
• Other Authors: Gan Chee Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials; DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/51193
• Institution: Nanyang Technological University

“More than Moore” trend has triggered the development of three-dimensional (3D) technologies which are important in terms of their reliability and performance. However, the introduction of these new technologies presents new challenges in fault isolation and failure analysis of short circuits, open...