Development of magnetic current imaging for the failure analysis of 3D package technology

• المؤلف الرئيسي: Kor, Katherine Hwee Boon.
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials; DRNTU::Engineering::Materials::Electronic packaging materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/51193

“More than Moore” trend has triggered the development of three-dimensional (3D) technologies which are important in terms of their reliability and performance. However, the introduction of these new technologies presents new challenges in fault isolation and failure analysis of short circuits, open...