Intermetallic formation and oxidation in AL-AU system

Intermetallic formation and oxidation in AL-AU system

Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging technology for making interconnections, but the controversies over the interface intermetallic phases and some diffusional aspects have not been resolved. Further, no systematic investigations appear...

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Bibliographic Details
Main Author: Xu, Cong
Other Authors: Thirumany, Sritharan
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:https://hdl.handle.net/10356/5121
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Institution: Nanyang Technological University
Description
Summary:Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging technology for making interconnections, but the controversies over the interface intermetallic phases and some diffusional aspects have not been resolved. Further, no systematic investigations appear to have been reported on the effects of anneal temperature and time.

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