Intermetallic formation and oxidation in AL-AU system

Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging technology for making interconnections, but the controversies over the interface intermetallic phases and some diffusional aspects have not been resolved. Further, no systematic investigations appear...

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Bibliographic Details
Main Author: Xu, Cong
Other Authors: Thirumany, Sritharan
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/5121
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Institution: Nanyang Technological University
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