Intermetallic formation and oxidation in AL-AU system

Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging technology for making interconnections, but the controversies over the interface intermetallic phases and some diffusional aspects have not been resolved. Further, no systematic investigations appear...

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Main Author: Xu, Cong
Other Authors: Thirumany, Sritharan
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/5121
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-51212020-06-01T11:56:51Z Intermetallic formation and oxidation in AL-AU system Xu, Cong Thirumany, Sritharan School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging technology for making interconnections, but the controversies over the interface intermetallic phases and some diffusional aspects have not been resolved. Further, no systematic investigations appear to have been reported on the effects of anneal temperature and time. DOCTOR OF PHILOSOPHY (SME) 2008-09-17T10:20:32Z 2008-09-17T10:20:32Z 2008 2008 Thesis Xu, C. (2008). Intermetallic formation and oxidation in AL-AU system. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/5121 10.32657/10356/5121 Nanyang Technological University 211 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Xu, Cong
Intermetallic formation and oxidation in AL-AU system
description Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging technology for making interconnections, but the controversies over the interface intermetallic phases and some diffusional aspects have not been resolved. Further, no systematic investigations appear to have been reported on the effects of anneal temperature and time.
author2 Thirumany, Sritharan
author_facet Thirumany, Sritharan
Xu, Cong
format Theses and Dissertations
author Xu, Cong
author_sort Xu, Cong
title Intermetallic formation and oxidation in AL-AU system
title_short Intermetallic formation and oxidation in AL-AU system
title_full Intermetallic formation and oxidation in AL-AU system
title_fullStr Intermetallic formation and oxidation in AL-AU system
title_full_unstemmed Intermetallic formation and oxidation in AL-AU system
title_sort intermetallic formation and oxidation in al-au system
publishDate 2008
url https://hdl.handle.net/10356/5121
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