Intermetallic formation and oxidation in AL-AU system
Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging technology for making interconnections, but the controversies over the interface intermetallic phases and some diffusional aspects have not been resolved. Further, no systematic investigations appear...
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| 格式: | Theses and Dissertations |
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2008
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| 在線閱讀: | https://hdl.handle.net/10356/5121 |
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| 機構: | Nanyang Technological University |