Investigation and optimization of in-process dressing of chemical mechanical polishing

• Main Author: Zaw Moe Aung
• Other Authors: Butler, David Lee
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/5510
• Institution: Nanyang Technological University

Chemical Mechanical Polishing (CMP) is the technique known to provide global planarization of topography with low post planarization slope and it is a technique to planarize the dielectric layers, which insulate the multilevel interconnect and it can reduces the topography over layer scales the conv...