Processibility and reliability of conductive adhesive materials
This project aims to study the effects of different bonding parameters such as bonding pressure, temperature, time during assembly process in relation to the assembly yield and the reliability of the Anisotropic Conductive Film (ACF) joints. The ACF used in this project is Hitachi AC212B ACF. Dif...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6023 |
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| Institution: | Nanyang Technological University |