Process and reliability studies of solder bumping using eutectic sn/pb solder
This project studies the differences in solder bumping using different bumping technologies. The two technologies of interest are printing technology and plating technology for solder deposition process. It was found that printing technology required two mask sets as compared to 1 mask for plati...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/6083 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Summary: | This project studies the differences in solder bumping using different
bumping technologies. The two technologies of interest are printing
technology and plating technology for solder deposition process. It was
found that printing technology required two mask sets as compared to 1
mask for plating technology. In printing technology, bump voids are an
inherent defect and must be controlled to within less than 30% of the bump
volume. The additional mask cost will add to the production cost. In large
volume manufacturing, the price for bumping between printing and plating is
now close to each other. |
|---|