Process and reliability studies of solder bumping using eutectic sn/pb solder

Process and reliability studies of solder bumping using eutectic sn/pb solder

This project studies the differences in solder bumping using different bumping technologies. The two technologies of interest are printing technology and plating technology for solder deposition process. It was found that printing technology required two mask sets as compared to 1 mask for plati...

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Main Author: Lo, Marvin Chen Yang.
Other Authors: Zhong, Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing::Production management
Online Access:http://hdl.handle.net/10356/6083
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-6083
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spelling sg-ntu-dr.10356-60832023-03-11T16:57:34Z Process and reliability studies of solder bumping using eutectic sn/pb solder Lo, Marvin Chen Yang. Zhong, Zhaowei School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing::Production management This project studies the differences in solder bumping using different bumping technologies. The two technologies of interest are printing technology and plating technology for solder deposition process. It was found that printing technology required two mask sets as compared to 1 mask for plating technology. In printing technology, bump voids are an inherent defect and must be controlled to within less than 30% of the bump volume. The additional mask cost will add to the production cost. In large volume manufacturing, the price for bumping between printing and plating is now close to each other. Master of Science (Mechanics & Processing of Materials) 2008-09-17T11:06:22Z 2008-09-17T11:06:22Z 2005 2005 Thesis http://hdl.handle.net/10356/6083 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing::Production management
spellingShingle DRNTU::Engineering::Manufacturing::Production management
Lo, Marvin Chen Yang.
Process and reliability studies of solder bumping using eutectic sn/pb solder
description This project studies the differences in solder bumping using different bumping technologies. The two technologies of interest are printing technology and plating technology for solder deposition process. It was found that printing technology required two mask sets as compared to 1 mask for plating technology. In printing technology, bump voids are an inherent defect and must be controlled to within less than 30% of the bump volume. The additional mask cost will add to the production cost. In large volume manufacturing, the price for bumping between printing and plating is now close to each other.
author2 Zhong, Zhaowei
author_facet Zhong, Zhaowei
Lo, Marvin Chen Yang.
format Theses and Dissertations
author Lo, Marvin Chen Yang.
author_sort Lo, Marvin Chen Yang.
title Process and reliability studies of solder bumping using eutectic sn/pb solder
title_short Process and reliability studies of solder bumping using eutectic sn/pb solder
title_full Process and reliability studies of solder bumping using eutectic sn/pb solder
title_fullStr Process and reliability studies of solder bumping using eutectic sn/pb solder
title_full_unstemmed Process and reliability studies of solder bumping using eutectic sn/pb solder
title_sort process and reliability studies of solder bumping using eutectic sn/pb solder
publishDate 2008
url http://hdl.handle.net/10356/6083
_version_ 1761781499050328064

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