Process and reliability studies of solder bumping using eutectic sn/pb solder

• المؤلف الرئيسي: Lo, Marvin Chen Yang.
• مؤلفون آخرون: Zhong, Zhaowei
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing::Production management
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/6083

This project studies the differences in solder bumping using different bumping technologies. The two technologies of interest are printing technology and plating technology for solder deposition process. It was found that printing technology required two mask sets as compared to 1 mask for plati...