Process and reliability studies of solder bumping using eutectic sn/pb solder
This project studies the differences in solder bumping using different bumping technologies. The two technologies of interest are printing technology and plating technology for solder deposition process. It was found that printing technology required two mask sets as compared to 1 mask for plati...
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/6083 |
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| 機構: | Nanyang Technological University |