Development of polyurethane rubber- modified epoxy resin for microelectronics packaging

• Main Author: Bhangale Sunil Madhukar.
• Other Authors: Chian, Kerm Sin
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/6084
• Institution: Nanyang Technological University

This project seeks to modify and characterise an epoxy-moulding compound using polyurethane-based rubber (stress modifier) for microelectronics packaging. The possibilities of incorporating polyurethane stress modifiers in a commercial moulding compound and their effects on its properties are explored. Two types of polyurethane (PU) namely, non-reactive PU and reactive PU are synthesised from a proprietary polyol, Polyol-A and an Isocyanate-A. The non-reactive PU stress modifier is a hydroxyl-terminated PU (OH-PU) while, the reactive PU stress modifiers are epoxide-terminated PU (Epo-PU) and PU-modified hardener (PUPH). Epo-PU and PUPH are synthesised via an intermediate, isocyanate-terminated PU (NCO-PU). PUPH-3070 and PUPH-4060, containing 30% and 40% by weight of NCO-PU respectively are synthesised.