Development of polyurethane rubber- modified epoxy resin for microelectronics packaging

• Main Author: Bhangale Sunil Madhukar.
• Other Authors: Chian, Kerm Sin
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/6084
• Institution: Nanyang Technological University

This project seeks to modify and characterise an epoxy-moulding compound using polyurethane-based rubber (stress modifier) for microelectronics packaging. The possibilities of incorporating polyurethane stress modifiers in a commercial moulding compound and their effects on its properties are explor...