Development of polyurethane rubber- modified epoxy resin for microelectronics packaging
This project seeks to modify and characterise an epoxy-moulding compound using polyurethane-based rubber (stress modifier) for microelectronics packaging. The possibilities of incorporating polyurethane stress modifiers in a commercial moulding compound and their effects on its properties are explor...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6084 |
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| Institution: | Nanyang Technological University |