Optimization and application of Epon SU-8, an ultra-thick negative photoresist

Another application that requires ultra-thick photoresist films is micromachining in MEMS. Extremely large structure heights are frequently required for micro-electrodeposition of mechanical components such as coils, cantilevers and valves. These applications may require photoresist in excess of a h...

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Main Author:	Tan, Khee Lip.
Other Authors:	Yang, Lin Jiang
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/6465
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6465
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spelling	sg-ntu-dr.10356-64652023-03-11T17:17:55Z Optimization and application of Epon SU-8, an ultra-thick negative photoresist Tan, Khee Lip. Yang, Lin Jiang School of Mechanical and Production Engineering Gong, Thomas Haiqing DRNTU::Engineering::Manufacturing Another application that requires ultra-thick photoresist films is micromachining in MEMS. Extremely large structure heights are frequently required for micro-electrodeposition of mechanical components such as coils, cantilevers and valves. These applications may require photoresist in excess of a hundred microns in thickness. The patterning of high aspect ratio structures in these ultra-thick photoresist films is extremely challenging. The aspect ratios easily exceed those encountered in submicron lithography for standard integrated circuit (IC) manufacturing. Unlike thin photoresist for IC manufacturing, lithography modelling and characterisation are not readily available for ultra-thick photoresist films. Master of Engineering (MPE) 2008-09-17T11:15:40Z 2008-09-17T11:15:40Z 2000 2000 Thesis http://hdl.handle.net/10356/6465 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Tan, Khee Lip. Optimization and application of Epon SU-8, an ultra-thick negative photoresist
description	Another application that requires ultra-thick photoresist films is micromachining in MEMS. Extremely large structure heights are frequently required for micro-electrodeposition of mechanical components such as coils, cantilevers and valves. These applications may require photoresist in excess of a hundred microns in thickness. The patterning of high aspect ratio structures in these ultra-thick photoresist films is extremely challenging. The aspect ratios easily exceed those encountered in submicron lithography for standard integrated circuit (IC) manufacturing. Unlike thin photoresist for IC manufacturing, lithography modelling and characterisation are not readily available for ultra-thick photoresist films.
author2	Yang, Lin Jiang
author_facet	Yang, Lin Jiang Tan, Khee Lip.
format	Theses and Dissertations
author	Tan, Khee Lip.
author_sort	Tan, Khee Lip.
title	Optimization and application of Epon SU-8, an ultra-thick negative photoresist
title_short	Optimization and application of Epon SU-8, an ultra-thick negative photoresist
title_full	Optimization and application of Epon SU-8, an ultra-thick negative photoresist
title_fullStr	Optimization and application of Epon SU-8, an ultra-thick negative photoresist
title_full_unstemmed	Optimization and application of Epon SU-8, an ultra-thick negative photoresist
title_sort	optimization and application of epon su-8, an ultra-thick negative photoresist
publishDate	2008
url	http://hdl.handle.net/10356/6465
_version_	1761781999115173888

Optimization and application of Epon SU-8, an ultra-thick negative photoresist

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