To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials

Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack pro...

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Bibliographic Details
Main Author:	Wan, Kai Tak
Other Authors:	School of Mechanical and Aerospace Engineering
Format:	Research Report
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Online Access:	http://hdl.handle.net/10356/7014
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-7014
record_format	dspace
spelling	sg-ntu-dr.10356-70142023-03-04T18:09:08Z To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials Wan, Kai Tak School of Mechanical and Aerospace Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack propagation of the interface between dissimilar materials is a common failure mode and is strongly dependent on the adhesion strength of the interface. 2008-09-18T05:58:57Z 2008-09-18T05:58:57Z 2006 2006 Research Report http://hdl.handle.net/10356/7014 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Wan, Kai Tak To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
description	Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack propagation of the interface between dissimilar materials is a common failure mode and is strongly dependent on the adhesion strength of the interface.
author2	School of Mechanical and Aerospace Engineering
author_facet	School of Mechanical and Aerospace Engineering Wan, Kai Tak
format	Research Report
author	Wan, Kai Tak
author_sort	Wan, Kai Tak
title	To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
title_short	To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
title_full	To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
title_fullStr	To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
title_full_unstemmed	To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
title_sort	to investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
publishDate	2008
url	http://hdl.handle.net/10356/7014
_version_	1759857402130202624

To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials

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